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PCB ASSEMBLY PROCESS

A controlled path from production data to verified PCBA.

ANZ Electric coordinates engineering review, material control, SMT and through-hole assembly, inspection and testing as one traceable manufacturing process.

DFM + DFAbefore production releaseSMT + THTmatched to the boardInspection gatesthrough final release
PCB assembly manufacturing
CONTROLLED PRODUCTIONRepeatable assembly backed by process verification.

PROCESS AT A GLANCE

Seven connected stages. One accountable workflow.

The exact route changes with board construction, component technology and test requirements, while quality checks remain embedded where they provide the clearest evidence.

01

Engineering review

02

Material control

03

Paste & SPI

04

Component placement

05

Controlled soldering

06

Inspection & test

07

Release & delivery

QUALITY GATES

Inspection is built into the process, not added at the end.

Stage-level checks create faster feedback and a clearer production record than relying on a single final inspection.

GATE 01

Incoming readiness

Confirm that the build package and materials suit the approved production route.

  • Document consistency
  • Part identity and condition
  • Moisture and storage controls
GATE 02

Process verification

Check paste, placement and soldering before defects move downstream.

  • SPI and first article
  • Placement accuracy
  • Thermal profile control
GATE 03

Product release

Verify workmanship, hidden joints and agreed functional requirements.

  • AOI / X-ray / visual
  • ICT or functional testing
  • Final records and packing

PROCESS ADAPTED TO THE PRODUCT

One framework, different assembly routes.

The sequence is adjusted to component mix, board sides, package density and required verification—not forced into a generic production path.

01

Single- and double-sided SMT

Stencil, placement and reflow stages planned for one or both board sides with controlled intermediate inspection.

02

Mixed SMT and through-hole

Surface-mount production coordinated with connectors and larger devices requiring a separate soldering process.

03

BGA and leadless packages

Placement, reflow and X-ray verification aligned to packages whose solder joints cannot be inspected optically.

04

Prototype through repeat production

Build records and approved settings establish a controlled foundation for repeatable future lots.

PLAN YOUR ASSEMBLY ROUTE

Share your production data. We will map the right PCBA process.

Send ANZ Electric your Gerber or ODB++, BOM, centroid data, drawings, quantity and test requirements for an engineering and manufacturing review.

Request a process review