Mixed PCB Assembly

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END-TO-END ELECTRONICS MANUFACTURING Find the right service for your product stage.

Move from design review and validation to prototype, specialist assembly and controlled production.

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Engineering & Validation

Prepare the design and data for reliable manufacturing.

PCB Design Consulting DFM Validation DFA Validation

Core Assembly

Understand the complete PCBA capability and production route.

PCB Assembly Services PCB Assembly Process

Production Programs

Select a build model around quantity, maturity and schedule.

Prototype PCB Assembly Low Volume PCB Assembly Quick-Turn PCB Assembly

Assembly Technologies

Explore process-specific assembly and inspection expertise.

Surface Mount (SMT) Assembly BGA Assembly Mixed PCB Assembly

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WHY MIXED ASSEMBLY

Use each component technology where it performs best.

SMT supports compact, high-density circuitry. Through-hole supports connectors, terminals, high-power devices and components exposed to mechanical load.

SMT

Compact and repeatable

Automated placement supports dense layouts, small packages and efficient board use.

THT

Robust and serviceable

Leaded components provide strong mechanical retention for interfaces and larger devices.

MIX

Integrated by design

A coordinated sequence protects existing joints and maintains access for later soldering and inspection.

PROCESS CHOICES

Match the through-hole route to the component mix.

Not every mixed board should follow the same soldering method.

Manual soldering

Suitable for limited quantities of accessible connectors or specialist components.

Selective soldering

Applies solder to defined through-hole areas while protecting nearby SMT content.

Wave soldering

Can support boards with a larger proportion of compatible through-hole components.

Product-specific combination

Multiple methods may be coordinated when board geometry or component sensitivity requires it.

PREPARE YOUR MIXED ASSEMBLY REVIEW

Make the complete component and process picture visible.

Clear assembly drawings and special-process notes are particularly important when multiple soldering methods share one board.

PCB data

Gerber or ODB++, drill files and stack-up.

BOM and component details

Packages, lead types, approved alternates and special handling.

Assembly drawings

Side, polarity, insertion and mechanical requirements.

Inspection and test scope

Acceptance criteria, test access and functional requirements.

Combine SMT density with through-hole strength.

Use each component technology where it performs best.

Compact and repeatable

Robust and serviceable

Integrated by design

Support compact circuitry and demanding interfaces on the same assembly.

Sequence SMT and THT without compromising either process.

DFA alignment

Print and place

Form SMT joints

Insert and solder

Inspect and test