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BGA ASSEMBLY SERVICES

Control what you cannot inspect with the naked eye.

ANZ Electric connects BGA design review, placement, thermal profiling, reflow and X-ray analysis to manage the risks hidden beneath the package.

Request a BGA reviewSee the process
Design reviewaround the packageThermal profilingfor the assemblyX-ray inspectionfor hidden joints
X-ray inspection equipment for BGA assembly
HIDDEN-JOINT VERIFICATIONBGA quality requires evidence below the component body.

BGA RISK CONTROL

The package, PCB and reflow profile must be reviewed together.

Ball composition, package size, laminate, surface finish, solder-mask clearance and board warpage can all affect BGA joint formation.

01

Package geometry

Pitch, ball pattern, body size and thermal mass influence placement and heating.

02

PCB compatibility

Pad design, mask clearance, finish, vias and laminate behaviour require alignment.

03

Thermal profile

Ramp, soak, peak and cooling conditions are matched to component and solder requirements.

04

Hidden-joint evidence

X-ray analysis supports detection of bridges, opens, voiding and alignment concerns.

BGA ASSEMBLY WORKFLOW

Five controls around one inspection-sensitive package.

The route is developed from the released design and package information rather than applying a generic oven setting.

01 / REVIEW

Design and data

Package, pad, vias and materials.

02 / PRINT

Paste control

Stencil aperture and deposit.

03 / PLACE

BGA alignment

Position and orientation control.

04 / REFLOW

Thermal profile

Heating matched to the package.

05 / X-RAY

Joint verification

Hidden connection analysis.

DESIGN INPUTS THAT MATTER

Review the conditions around the BGA before production.

A complete review helps engineering select the appropriate assembly and inspection route.

01

Package and solder specification

Datasheet limits, ball composition and moisture sensitivity inform preparation and reflow.

02

PCB pad and mask geometry

Land pattern, solder-mask clearance and via strategy influence joint formation.

03

Board material and surface finish

Laminate behaviour, finish and warpage expectations affect process planning.

04

Acceptance and test requirements

Inspection criteria and product-level testing define the evidence required for release.

PREPARE YOUR BGA REVIEW

Share the package information with the assembly data.

The production package should allow review of both the BGA itself and the PCB conditions surrounding it.

01

PCB fabrication data

Gerber or ODB++, stack-up, finish and via details.

02

BOM and datasheets

BGA part number, ball composition and handling requirements.

03

Assembly data

Centroid, drawings, orientation and process notes.

04

Acceptance requirements

Quantity, X-ray criteria and electrical or functional test scope.

START YOUR BGA REVIEW

Plan placement, reflow and X-ray as one controlled process.

Send ANZ Electric your design package and BGA requirements for an engineering review.

Request a BGA review