Print with consistency
Stencil design, paste condition and print settings are aligned to pad geometry and component requirements.
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SURFACE MOUNT (SMT) ASSEMBLY
ANZ Electric combines design review, controlled solder paste printing, automated component placement, reflow profiling and inspection to produce dependable SMT assemblies.

THE SMT CONTROL CHAIN
Paste deposit, component data, thermal behaviour and inspection criteria must work as one system to create stable solder joints.
Stencil design, paste condition and print settings are aligned to pad geometry and component requirements.
Centroid data, polarity, feeder setup and first-article checks control position and orientation.
A suitable thermal profile forms the joint while protecting the PCB and temperature-sensitive components.
PACKAGE FLEXIBILITY
Assembly preparation is matched to package geometry, pitch, board construction and inspection accessibility.
SMT WORKFLOW
The exact route changes by board and package type, while stage-level checks keep the process visible.
Footprints, polarity and placement files.
Deposit coverage and alignment.
Coordinates, feeders and orientation.
Profile matched to the assembly.
AOI, X-ray and agreed testing.
PREPARE YOUR SMT REVIEW
Aligned files allow engineering to assess packages, stencil requirements, placement and inspection before release.
Gerber or ODB++, stack-up and fabrication notes.
Part numbers, packages and approved alternates.
Reference, side, position and rotation.
Quantity, test scope and special handling notes.
START YOUR SMT REVIEW
Share your board data, BOM and assembly requirements for an engineering and manufacturing review.