Vietnam PCBA manufacturing partner · Design to shipment Vietnam · Singapore · Hong Kong · Israel | +65 6539 9379

INDUSTRIES INSIGHTS ABOUT CONTACT

BGA Rework & Reballing Services

Recover High-Value Assemblies With A Controlled Process.

A BGA recovery decision must account for the component, PCB, solder site and thermal process together—not simply whether the package can be physically removed.

Request A BGA Recovery Review See The Control Chain

Package contextPart, geometry and handling limitsBoard protectionSite condition and thermal controlHidden evidenceX-ray-based verification

X-ray verification for BGA packages — REMOVE · REBALL · REFLOW · VERIFYControl what is hidden below the component body.

When To Consider Recovery

Assess The Alternative To Full Board Replacement.

Suitability depends on PCB condition, pad integrity, component history, package specification, thermal sensitivity and programme acceptance criteria.

Remove & Inspect

Evaluate the component and the board site before committing to a recovery route.

Reball If Suitable

Recover a suitable BGA component around its specification and history.

Replace If Approved

Install an approved replacement with controlled placement and reflow.

Verify Hidden Joints

Use X-ray evidence and the required functional acceptance route.

BGA Recovery Control Chain

Four Controls Around One Inspection-Sensitive Package.

The method is selected around the package and board condition—not applied as a generic thermal setting.

01 / ASSESS

Package & Board

Review part number, data sheet, geometry, board data, ball type and failure context.

02 / PREPARE

Removal & Site

Control removal and site preparation to reduce disturbance to the assembly.

03 / RECOVER

Reball Or Replace

Plan placement and reflow around the component, board and solder requirements.

04 / VERIFY

Hidden Evidence

Use X-ray for bridges, opens, voiding and alignment concerns before release.

Information For A Useful Review

Provide The Evidence Around The Recovery Objective.

If failure analysis is incomplete, state that clearly. The first stage can be an assessment of evidence and next steps rather than an unqualified repair commitment.

BGA part number and data sheetPCB data, drawings and stack-upIssue description or recovery objectiveQuantity, timing and supply modelX-ray or functional test requirementsAcceptance criteria and needed records

Link Recovery To Quality

Place Rework In The Wider Manufacturing And Quality Route.

A recovered assembly needs a clear evaluation route before it returns to use. Inspection evidence must connect with the programme’s functional and release requirements.

For new-production package planning, review BGA assembly design, placement, thermal profiling and hidden-joint considerations. For wider release planning, use the current quality control framework as the evidence baseline.

Controlled BGA Recovery

Assess The Package And Board Before Committing To A Route.

Send the available information for a technical and manufacturing review of the recovery or reballing decision.

Send Package & Board Details